261 - 270 of 499
bga package power amplifier chip
Selling leads
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... power domains while using as little as 0.65mW per channel at 2Mbps with 1.8V.MAX12931CASA+ devices are available with a maximum data rate of ...
2025-07-14 00:20:07
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... 4pin package, Technology with the highest power density with up to 140 A rating. Specification Of IKY75N120CH7XKSA1 Part Number IKY75N120CH7XKSA1 ...
2025-07-23 00:18:53
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... with 60% space reduction for telecom and low voltage drives applications. Specification Of IPT026N10N5ATMA1 Part Number IPT026N10N5ATMA1 Ptot max ...
2025-07-24 00:25:01
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...h limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for ...
2025-07-02 00:18:46
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...Chips 2MB SAK-TC233LP-32F200F AB 32-Bit AURIX TriCore Microcontroller IC Product Description Of SAK-TC233LP-32F200F AB SAK-TC233LP-32F200F AB A ...
2024-12-09 21:29:39
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... management solution in a small package. TPS259824LNRGER operational over a wide input voltage range. A single part caters to lowvoltage systems ...
2025-07-24 00:24:51
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...Chips FFSD1065B-F085 TO-252 Silicon Carbide Schottky Diodes Product Description Of FFSD1065B-F085 FFSD1065B-F085 is Silicon Carbide Schottky ...
2025-07-24 00:24:57
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..., 650V, Surface Mount. The package is D²PAK-2 (TO-263-2). Specification Of FFSB0665B-F085 Part Number: FFSB0665B-F085 Reverse Recovery Time (Trr): ...
2025-07-24 00:24:56
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...Chip H2PAK-7 Product Description Of SCT012H90G3AG SCT012H90G3AG is Automotive-grade silicon carbide Power MOSFET Transistors, 900V, 12mOhm typ., ...
2025-07-24 00:24:58
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...Chip Product Description Of IPP65R190CFD7A IPP65R190CFD7A is 650V CoolMOS CFD7A SJ Power Device, the package is TO-220-3, Through Hole. Specificat...
2025-07-23 00:18:52
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