191 - 200 of 499
bga package power amplifier chip
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... solid silicon carbide technology. Specification Of IMZA65R027M1H Part Number IMZA65R027M1H Power Dissipation (Max) 189W (Tc) Operating Temperature ...
2025-07-23 00:18:41
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... MOSFETs.It is designed for ease of use,low external component count,and small package power systems. Specification Of TPS53314RGFR Part Number ...
2025-07-23 00:18:33
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...Chip CYPDC1185B2-32LQXQ USB Type C Port Controller QFN Package Product Description Of CYPDC1185B2-32LQXQ CYPDC1185B2-32LQXQ is USB-C Power ...
2025-06-22 00:16:23
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...Chips EP2C35F672C6N Integrated Circuit Chip 672-FBGA Field Programmable Gate Array Product Description Of EP2C35F672C6N EP2C35F672C6N Cyclone II ...
2025-07-23 00:18:41
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Apple IC Chip APL1098 Apple 13/Pro Power management IC Specifications Part Number: APL1098 Type: Apple IC Chip Package: QFN Product Category: Power ...
2025-06-22 00:16:23
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Power Management IC MFS2603AMBA0AD 2 GPIO Safety SBCs Chip HLQFP48 Package Product Description Of MFS2603AMBA0AD The MFS2603AMBA0AD of automotive ...
2025-07-23 00:18:25
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...Chip IAUTN06S5N008T Single MOSFETs Transistors PG-HDSOP-16 Product Description Of IAUTN06S5N008T IAUTN06S5N008T is optiMOS™ 5 Automotive Power ...
2025-07-23 00:18:37
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... CMOS dynamic random access storage device with multi-chip package (MCP) and package overlay (PoP) design to save PCB space. LPDDR4 memory devices ...
2025-07-02 00:18:46
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...Chip MT53E1G32D2NP-053 RS WT:C 32G DRAM LPDDR4 Memory IC Surface Mount Product Description Of MT53E1G32D2NP-053 RS WT:C MT53E1G32D2NP-053 RS WT:C ...
2025-07-02 00:18:46
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Automobile MOSFET AUIRF8739L2TR 40V Automotive Single N-Channel HEXFET Power MOSFET Description AUIRF8739L2 combines the latest Automotive HEXFET® ...
2025-07-23 00:18:21
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