201 - 210 of 499
bga package power amplifier chip
Selling leads
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... at ultra-low power and live at the edge of the IoT. Specification Of MAX78002GXE Part Number MAX78002GXE Connectivity CSI, FIFO, I²C, MMC/SD/SDIO, ...
2025-06-22 00:16:28
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...Power Modules MSC2X51SDA170J Integrated Circuit Chip SOT-227-4 N-Channel Product Description Of MSC2X51SDA170J MSC2X51SDA170J is Dual Silicon ...
2025-07-23 00:18:41
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... (D3PAK) package. Specification Of MSC360SMA120S Part Number: MSC360SMA120S Technology: SiC Package / Case: TO-268 Transistor Polarity: N-Channel ...
2025-07-14 00:20:07
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...Power MOSFET MSC750SMA170S Integrated Circuit Chip TO-268-3 Product Description Of MSC750SMA170S MSC750SMA170S is a 1700 V, 750 mΩ Silicon Carbide ...
2025-07-14 00:20:07
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... 32-bit TriCore CPUs, the package is 416-BGA(Surface Mount). Specification Of SAL-TC298TP-128F300N BC Part Number: SAL-TC298TP-128F300N BC Speed: ...
2025-07-23 00:18:16
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...Chip 88Q2221MA0-NYA2A0G1 Automotive PHY Ethernet Switches IC Product Description Of 88Q2221MA0-NYA2A0G1 88Q2221MA0-NYA2A0G1 transceiver implements ...
2025-07-14 00:20:12
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...Chips MFS2613AMDA0AD 3.2V System Basis Chip For ASIL-D LQFP-48 Package Product Description Of MFS2613AMDA0AD The MFS2613AMDA0AD automotive safety ...
2025-07-14 00:20:04
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...Chip APQ-8053-A-792NSP-MT-01-1-AA System-On-Chips For IoT QFN Package Product Description Of APQ-8053-A-792NSP-MT-01-1-AA APQ-8053-A-792NSP-MT-01-1...
2024-12-09 23:42:00
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...Chip MT53E512M32D1ZW-046 AAT:B 16Gbit SDRAM-Mobile LPDDR4X Memory IC Product Description Of MT53E512M32D1ZW-046 AAT:B MT53E512M32D1ZW-046 AAT:B ...
2025-07-02 00:18:46
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...Chip ASM3142 USB 3.1 Gen 2 Controller Chip QFN64 Apple IMac/PCIe Product Description Of ASM3142 ASM3142 uses PCI-E 3.0 X2 channels and can provide ...
2025-01-26 21:26:54
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