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picosecond laser wafer scribing machine
Selling leads
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Equipment Overview The equipment is designed for marking wafers up to 8 inches in size, as well as for scribing MARK points and characters on ITO ...
2026-06-27 00:18:05
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...machine adopts a picosecond laser to process perovskite, light-absorbing layers or metal electrode layers. Driven by short-pulse high-peak laser, ...
2026-06-27 00:18:05
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...lasers and optical path structures, this equipment is designed for scribing perovskite and edge cleaning of the perovskite layer. It first uses ...
2026-06-27 00:18:05
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... line exceeding 20 MΩ, no TCO residue inside the scribe channel, and no damage to the glass substrate. Meanwhile, it can also perform P4 laser edge ...
2026-06-27 00:18:05
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