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semiconductor packaging and testing equipment
Selling leads
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Equipment Overview The system adopts an advanced laser source dedicated to glass drilling, fully leveraging the advantages of laser processing such as ...
2026-05-24 00:30:27
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Equipment Overview The equipment is designed for marking wafers up to 8 inches in size, as well as for scribing MARK points and characters on ITO ...
2026-05-24 00:30:27
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Equipment Overview The equipment adopts a dual-drive gantry platform and a customized feeding system. It is compatible with Gel-Pak, Wafer Pak, ...
2026-03-31 07:30:18
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Equipment Overview This equipment is configured with a dual-drive gantry platform and a customized feeding platform, compatible with expansion rings, ...
2026-03-31 07:30:18
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Equipment Overview The equipment is designed for the pick-and-place (P&P) of FRD, IGBT chips, resistors, and soldering tabs. It can operate as a ...
2026-03-31 07:30:18
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Equipment Overview This equipment is designed for the high-precision assembly of optical modules, HDMI/USB connectors, sensors, optical devices, light ...
2026-03-31 07:30:18
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