1 - 10 of 51 Selling leads
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Equipment Overview The system adopts an advanced laser source dedicated to glass drilling, fully leveraging the advantages of laser processing such as ...
2026-05-24 00:30:27
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Equipment Overview The equipment is designed for marking wafers up to 8 inches in size, as well as for scribing MARK points and characters on ITO ...
2026-05-24 00:30:27
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Equipment Introduction Adopting self-developed lasers and optical path structures, this equipment is designed for scribing perovskite and edge ...
2026-05-24 00:30:27
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Equipment Introduction This Perovskite P1/P4 laser scribing and edge cleaning machine can perform P1 laser scribing: removing the TCO layer, with the ...
2026-05-24 00:30:27
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Equipment Introduction The laser beam irradiates the PSG surface and penetrates into the Poly layer, where the surface of the Poly layer absorbs ...
2026-05-24 00:30:27
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Equipment Introduction This machine adopts a picosecond laser to process perovskite, light-absorbing layers or metal electrode layers. Driven by short...
2026-05-24 00:30:27
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Equipment Introduction The equipment’s laser system uses instantaneous high-energy-density laser to achieve ablation and evaporation, selectively ...
2026-05-24 00:30:27
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Equipment Overview The equipment irradiates the cell surface with high-energy laser to excite carriers and generate localized high-density current, ...
2026-05-24 00:30:27
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This equipment is composed of the laser host, laser emitting head, industrial 6-axis robot, welding table, welding fixture (2 sets), chiller, smoke ...
2026-05-24 00:30:27
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UW Laser has fully opened up the mass production path of cylindrical batteries that have no tabs to realize the intelligent production of multi...
2026-05-24 00:30:27
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