Equipment Introduction This machine adopts a picosecond laser to process perovskite,
light-absorbing layers or metal electrode layers. Driven by
short-pulse high-peak laser, it ensures no craters at the edges
while scribing on the material surface, delivering controllable and
stable processing results. It can accurately position and remove
the target film layers to a precise depth without damaging the TCO
substrate, and the scribed grooves feature excellent flatness and
consistency at the bottom. Highlights - Self-developed laser and optical design; scribing line width
adjustable from 20-100μm, P2 crater <50nm, P3 crater <100nm.
- Modular and flexible overall design; P2/P3 integrated in one
machine for easy operation.
- High-precision visual tracking and high-speed flexible mechanism
transmission, dead zone <100μm achievable.
- Independently developed dust extraction, air blowing, visual
positioning and focus tracking systems.
- Self-developed dual optical path system for single-station
processing, enabling P2/P3 scribing.
- Gas purification system optional: realizes gas cyclic purification
to remove water, oxygen and organic gases, achieving H₂O &
O₂level below 1PPM.
- Sealed chamber (glove box) optional: made of stainless steel or
acrylic, filled with inert gas, equipped with glove ports and
gloves for operation.
- Mechanical structure composed of marble platform and high-precision
linear motor, carrying optical system and process fixtures.
- Optical system: consisting of ultra-fast laser, beam expander,
reflector, DOE, focusing lens and other components.
Technical Parameters | Equipment Performance | Specifications | | Laser | IR/Green/UV picosecond laser | | Power | 5–60W, optional | | Applicable Cell Size | 600×600mm (Customizable) | | Straightness | ＜5μm/m | | Positioning Accuracy | ±5μm | | Repeat Positioning Accuracy | ±2μm | | Dead Zone | ＜100μm | | Spot Shape | Square or circular spot | | Line Width | 20–100μm, adjustable | | Equipment Dimension (L×W×H) | 2500*2000*2500mm |
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