51 - 60 of 68
box furnace for electronic components
Selling leads|
Mbf100-10 Type Chemical Vapor Deposition CVD Furnace 1000 ordm C Melting Furnace Heating Furnace ISO Certified Electric Fuel 1.Equipment Name and ...
2026-05-24 00:29:07
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... Configuration: The equipment is primarily used for high-temperature sintering and heat treatment of thick film circuits, thick film resistors, ...
2025-06-30 14:25:48
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...Furnace 755mm*1680mm*950mm W*H*D for Versatile Drying Applications 1.Typical applications: Primarily used for drying, debinding, and curing of ...
2026-05-24 00:29:07
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I. Equipment Name and Model: MBF100-10 Medium-temperature Clean Chamber Furnace II. Application Fields: It is mainly used for the high-temperature ...
2026-05-24 00:29:07
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MBF100-10 Medium-Temperature Clean Chamber Furnace ISO Certified and Equipped with Latest Technology
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I. Equipment Name and Model: MBF100-10 Medium-temperature Clean Chamber Furnace II. Application Fields: It is mainly used for the high-temperature ...
2026-05-24 00:29:07
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Htf2550-07 Heat Treatment Furnace for Steel Molding 1200*1700*2200mm W*H*D Effective Dimensions 250*500mm Typical applications: The sintering and ...
2026-05-24 00:29:07
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... for the drying, degumming and curing of electronic components in a vacuum or atmosphere environment. 3. Technical Indicators and Basic Configurati...
2026-05-24 00:29:07
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... for the drying, degumming and curing of electronic components in a vacuum or atmosphere environment. 3. Technical Indicators and Basic Configurati...
2026-05-24 00:29:07
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... materials, electronic ceramic components and other products. 2. Technical Specification: Rated Temp.:1500ºC Max Temp.:1600ºC Effective Dimensions...
2026-05-24 00:29:07
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... materials, electronic ceramic components and other products. 2. Technical Specification: Rated Temp.:1500ºC Max Temp.:1600ºC Effective Dimensions...
2026-05-24 00:29:07
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