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box furnace for electronic components
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... components, ceramic filters, etc. II. Core Technologies & Performance Specifications Temperature Parameters Rated Temperature: 1650°C Maximum ...
2026-05-24 00:29:07
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...Overview Name/Model: HBF52-17NO High-Temperature Box Furnace Application Fields: Suitable for high-temperature sintering processes of ITO targets, ...
2026-05-24 00:29:07
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... processing, featuring: Dual atmosphere capability (air/oxygen) Optimized for ITO targets and electronic ceramics Compact footprint with high ...
2026-05-24 00:29:07
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... for processes such as drying, curing, or debinding of semiconductors, electronic components, or materials. 2. Technical Specification: 2.1. Rated ...
2025-07-29 13:07:11
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... processes of lithium battery cathode and anode materials, and is also applicable to the sintering of magnetic materials, electronic components, ...
2026-05-24 00:29:07
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...Furnace 1150 ordm C Mbf40-11n Type Atmosphere Box Furnace with ISO Certification 1. Applications: It is primarily used for the sintering process of ...
2026-05-24 00:29:07
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...Box Furnace II. Application Fields: Primarily used for degassing, sintering, and curing processes of LTCC, glass, electronic components, electronic ...
2026-05-24 00:29:07
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Industrial Range Mbf22-10 Atmosphere Box Furnace Nitrogen Muffle Furnace 1000 ordm C for High Temperature Applications 1. Applications: Mainly used ...
2026-05-24 00:29:07
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...Overview Name/Model: HBF52-17NO High-Temperature Box Furnace Application: Suitable for high-temperature sintering processes such as ITO targets, ...
2026-05-24 00:29:07
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Product Description I.The MBF64-11 medium-temperature box furnace uses silicon carbide rods inserted in ceramic tubes as heating elements, which are ...
2026-05-24 00:29:07
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