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Selling leads
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... the thermal resistance between the heat source and the heat sink. TIF100-30-06UF-Series-Datasheet-.pdf Features > Good thermal conductive: 3.0 W...
2025-07-26 00:03:35
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...Pad for Notebook The TIF160-05UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant ...
2025-07-26 00:03:36
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Good Thermal Conductive TIF1200-05UF Heat Sink Pad for Automotive Electronics The TIF1200-05UF is recommended for applications that require a minimum ...
2025-07-26 00:03:36
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...Pad for MD LED Module The TIF1160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-07-26 00:03:35
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...Pad for IT Infrastructure The TIF140N-40-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-07-26 00:03:35
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Good Thermal Conductive TIF180N-40-10F Heat Sink Pad for LED PanelLight The TIF180N-40-10F is recommended for applications that require a minimum ...
2025-07-26 00:03:35
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... the thermal resistance between the heat source and the heat sink. TIF100N-40-10F-Specification-sheet.pdf Features > Good thermal conductive: 4.0 W...
2025-07-26 00:03:35
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...Pad for Notebook The TIF1180N-50-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-07-26 00:03:35
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... the thermal resistance between the heat source and the heat sink. TIF200-20-02ES-Series-Datasheet.pdf Features > Good thermal conductive:
2025-07-26 00:03:36
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...Pads for Handheld Portable Electronics The TIF2180-20-02ES use a special process, with silicone as the base material, adding thermal conductive ...
2025-07-26 00:03:36
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