3.0mmT Gray Easy Release Construction Thermal Pad for Routers
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3.0mmT Gray Easy Release Construction Thermal Pad for Routers
The TIF1120N-40-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100N-40-10F-Specification-sheet.pdf
Features > Good thermal conductive: 4.0 W/mK >Thickness: 3.0mmT >hardness:55±5 shore 00 >Colour: Gray >Available in varies thicknesses
Applications >cooling components to the chassis of frame >High speed mass storage drives >Heat Sinking Housing at LED-lit BLU in LCD >LED TV and LED-lit lamps >RDRAM memory modules >Micro heat pipe thermal solutions
Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL
FAQ: Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us. Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. |
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| Product Tags: Easy Release Construction Thermal Pad 3.0mm Thickness Thermal Pad Routers Thermal Silicone Pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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