4.5mm UL Recognized Low Cost Thermal Gap Pad For Notebook
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4.5mmT UL Recognized Low Cost Thermal Pad for Notebook
The TIF1180N-50-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100N-40-10F-Specification-sheet.pdf
Features > Good thermal conductive: 5.0 W/mK >Thickness: 4.5mmT >hardness:55±5 shore 00 >Colour: Gray >Available in varies thicknesses
Applications >mainboard/mother board >notebook >power supply >Heat pipe thermal solutions >Memory Modules >Mass storage devices
Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ: Q: Do you accept custom orders ? A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information . Q: How much are the pads? A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price. |
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| Product Tags: UL Recognized Thermal Pad 4.5mm Thermal Gap Pad Notebook Thermal Gap Pad Material | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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