1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction
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1.75mmT Heat Snk Pad Easy Release Construction for Display Card
The TIF170-30-06UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-30-06UF-Series-Datasheet-.pdf
Features > Good thermal conductive: 3.0 W/mK >Thickness: 1.75mmT >hardness:75±5 shore 00 >Colour: White >Good thermal conductive
Applications >Automotive engine control units >Telecommunication hardware >Handheld portable electronics >Semiconductor automated test equipment (ATE) >CPU >display card
Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ: Q:Is there promotion price for big buyer? A:Yes, we do have promotion price for big buyer. Please send us email for inquiry. Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. |
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| Product Tags: 1.75mm thermal gap pad easy release construction thermal gap pad 1.75mm thermal interface pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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