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flexible printed circuit electrolytic copper foil
Selling leads
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...: 99.8%. VLP ED Copper Foil Characteristics. 1. Zinc-free. 2. Excellent physics of high elongation Performance. Products use: - Flexible Printed ...
2025-03-18 22:32:56
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very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit. Surface: Mill,mirror,brush,hair line,checkered .etc Main Purpose: Copper ...
2025-03-18 22:33:03
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... mm,standard width:1290mm. 4> ID: 76 mm,152 mm. 5> Cu Content: Min 99.8%. VLP ED Copper foil Application: high-frequency board,Used for multilayer ...
2024-12-09 12:02:08
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...: 99.8%. VLP ED Copper Foil Characteristics. 1. Zinc-free. 2. Excellent physics of high elongation Performance. Products use: - Flexible Printed ...
2025-03-18 22:32:54
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... mm,152 mm. The treated foil in gray or red. High profile with properties of LP-S-B/R suitable for FCCL. Grain structure of copper foil leads to ...
2024-12-09 12:02:08
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...electrolytic copper foil for Chip on flex (COF) for LED. Product details introduction. Matte side treatment in back/red color. Thickness: 12µm. ...
2024-12-09 12:02:08
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ED Electrolytic Copper Foil with High Coarse for Double Face and Multiayer Printed Circuit Boards Overview: Range of Thickness: 0.012-0.070 mm Range ...
2025-03-18 22:32:59
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... enables to make fine circuit pattern. Application Casting and lamination type FCCL. LP/low profile Copper Foil of Properties. Classification Unit ...
2024-12-09 12:02:08
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very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit. Surface: Mill,mirror,brush,hair line,checkered .etc Main Purpose: Copper ...
2025-03-18 22:33:14
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.... It has ultra-thin properties and can be coated on both sides. It has the advantage of high load-carrying power and has good coating properties ...
2025-03-18 22:33:03
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