1 OZ Electrolytic Copper Foil For Fccl Grain Structure High Flexibility

Grain structure leads to high flexibility 1 OZ electrolytic copper foil for fccl.

Products Specifications introduction.

1> Matte side treated in back/red.

2> Thickness: 1OZ.

3> Width Range: 5-1380 mm,standard width:1290mm.

4> ID: 76 mm,152 mm.

5> Cu Content: Min 99.8%.

VLP ED Copper foil Application:

high-frequency board,Used for multilayer circuit boards,Flexible Copper Clad Laminate.

Very Low profile Copper Foils Features.

Grain structure of copper foil leads to high flexibility,Very Low profile enables to make fine circuit pattern,Good folding endurance and Zinc-free.

Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.

Remark:Standard width 1295(±1)mm,MAX width 1370mm,May according to the customer request tailor.We test the peel strength with PI ,please reconfirm with your pp.

Packaging:

RFQ:

Q9.Are the package suitable For export ?

Yes , it is suitable for export.

Q2: What's your delivery time ?

The common delivery time is 5-35 working days. The specific delivery time depends on the items and the quantity of your order.

Q12. Is it the Fumigation carton box?

Yes ,it is .