25um LP Ed Copper For FPC , High Temperature Resistance Copper Foil Roll
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High Temperature Resistance 25um High Conductivity LP ED Copper Foil for FPC.
Specification of LP Copper Foil.
LP Copper Foil Features and Performance.
Packaging:Use of LP Copper Foil.
Flexible Copper Clad Laminate with Casting and lamination type,Super fine pattern FPC,Chip on flex (COF) for LED,multilayer circuit boards.
Difference between rolled copper foil and electrolytic copper foil.
Performance is different ,Strength toughness: Rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than electrolytic copper foil, so most of the rolling copper foil used in flexible printed circuit boards.Width different:: rolling copper foil width ≤ 620mm, electrolytic copper foil width ≤ 1380mm.
LP/Low Profile Copper Foil of Properties.
Standard Width 1290mm,max width 1380(±1)mm,May according to the customer request. |
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Electric Vehicles PCB Copper Foil Li-Ion Battery Copper Foil |
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25um LP Ed Copper For FPC , High Temperature Resistance Copper Foil Roll |
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Clad Laminates / CCL Electrolytic Copper Foil Rolls 35 Micron Thickness |
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Double Side Shiny Copper Foil Thickness 4.5um 6um For Electric Vehicles Li-Ion Battery |
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4.5um 6um Double Side Rough Copper Foil For Lithium Ion Battery |
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Matte Side Treatment Very Low Profile Copper Foil 10um 12um 18um 25um 35um |