Low Profile ED Copper Foil Thickness 35um For Flexible Printed Circuit

very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit.

Products Specifications.

1) Thickness Range: 0.035mm.

2) standard width:1290mm.

3) ID: 76 mm,152 mm.

4) Cu Content: 99.8%.

VLP ED Copper Foil Characteristics.

1. Zinc-free.

2. Excellent physics of high elongation Performance.

Products use:

- Flexible Printed Circuit.

- LED layer of HDI .

Difference between rolled copper foil and electrolytic copper foil.

Process is difference: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process).

Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.

RFQ:

Q1.what is the Internal diameter?

76/152/ custom.

Q2. Is it possible be zinc free copper foil?

Yes ,it is possible.

Q3. Is it the Fumigation carton box?

Yes ,it is .

Packaging & Delivery.

1. Packaging Details:wooden carton.

2. Delivery Detail:25-30days,depend on quantity.

Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.

Remark:Standard Width 1295mm,max width 1380(±1)mm,May according to the customer request tailor.We test the peel strength with PI ,please reconfirm with your pp.