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single function module hermetic packages
Selling leads
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Main performance parameters Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator Lead welding method: ...
2025-05-13 09:46:55
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Main performance parameters Application fields: Modulator package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm ...
2025-05-13 09:46:55
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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ...
2025-05-13 09:46:55
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Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ...
2025-05-13 09:46:55
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... metal package for HIC custom hermetic package Product Model JOPTEC Finish: Shell and pins are plated Ni 1-11.43um and plated Au≥1.0um Insulation ...
2025-05-13 09:46:55
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Main performance parameters Application fields: optical communication module package Lead welding method: tin welding, gold wire bonding Nickel ...
2025-05-13 09:46:55
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... Ni:4~11.43um and Au≥1um;Cap is plated Ni:1.3~11.43um Insulation resistance 500V DC resistance between single pin and shell is ≥1*1010Ω Hermeticity ...
2025-05-13 09:46:55
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... Al2O3 12 Plating coating: Coating: shell and lead plating Ni:3-11.43um, lead plating Au>=1.3um. Hermeticity: Leak rate
2025-05-13 09:46:55
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...hermetically sealing circular package Plating: The bottom plate, the lead plating Ni:3-8.9um, the bottom plate and the lead plating Au>=0.03um. ...
2025-05-13 09:46:55
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...Package With 4J29 Alloy Product formation Material Quantity 1. bottom 4J29 1 2. lead 4J29 5 3. T shaped lead 4J29 1 4. glass insulator DM-305 5 5. ...
2025-05-13 09:46:55
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