China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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precise hermetically sealed packaging

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Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ... 2025-05-13 09:46:55
Product name: Highly Customized High Frequency Microwave Package Finish: Fully plating Au(or choose selective plating). Plating coating: The package, ... 2025-05-13 09:46:55
Product Name Flat Stock With Leads Parallel To The Substrate Mounting Surface Glass-To-Metal Seals Product Model JOPTEC Plating Coating Fully plating ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
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