China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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multi piece hermetic package

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multi piece hermetic package

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...Multi-piece flatpack butterfly metal package for HIC custom hermetic package Product Model JOPTEC Finish: Shell and pins are plated Ni 1-11.43um ... 2025-05-13 09:46:55
Main performance parameters Application fields: ICR package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ... 2025-05-13 09:46:55
Product name: Customized Iron-Nickel-Cobalt Flatpack Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: Package,pin... 2025-05-13 09:46:55
Product name: Kovar to glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the ... 2025-05-13 09:46:55
...43um, 1,and the package and lead are plated Au≥1.3um. Cover is plated Au:0.6-2.0um.2the package and pins are plated Au≥1.3um Product formation: ... 2025-05-13 09:46:55
...Package Finish: Fully plating Au(or choose selective plating). Plating coating: The package, lead and cover are plated Ni: 1.3-11.43um, 1,and the ... 2025-05-13 09:46:55
Main performance parameters Application field: pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
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