China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
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modulator hermetic package

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modulator hermetic package

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... layer thickness:> 0.45μm Hermeticity: leak rate ≤1x10-3Pa.cm3/s (He) Insulation resistance: ≥1000MΩ (DC500V) material: Base: Kovar alloy, iron... 2025-05-13 09:46:55
Main performance parameters Application fields: Modulator package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
... parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3... 2025-05-13 09:46:55
Main performance parameters Application fields: ICR package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
Product name: Customized Iron-Nickel-Cobalt Flatpack Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: Package,pin... 2025-05-13 09:46:55
... metal package for HIC custom hermetic package Product Model JOPTEC Finish: Shell and pins are plated Ni 1-11.43um and plated Au≥1.0um Insulation ... 2025-05-13 09:46:55
Main performance parameters Application fields: optical communication module package Lead welding method: tin welding, gold wire bonding Nickel ... 2025-05-13 09:46:55
Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ... 2025-05-13 09:46:55
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