41 - 50 of 59
modulator hermetic communication package
Selling leads
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Product name: High Volume TO Header TO-39 Header Plating: The bottom plate, the lead plating Ni:3-8.9um, the bottom plate and the lead plating Au>=0...
2025-05-13 09:46:55
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...package Product Model JT-TO Product Formation Material Quantity 1. Base Kovar 1 2. Pin Kovar 4 3. Glass insulator BH-A/K 4 4. Brazing ring HlAgCu28 ...
2025-05-13 09:46:55
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... 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have ...
2025-05-13 09:46:55
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... 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have ...
2025-05-13 09:46:55
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Product name: Robust Iron-Nickel-Cobalt Flatpack With Unusual Lead Forming Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating ...
2025-05-13 09:46:55
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... 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have ...
2025-05-13 09:46:55
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Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip ...
2025-05-13 09:46:55
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... ring HlAgCu28 1 6. Ceramic base Aluminum Nitride 1 Insulation Resistance 500V DC resistance between single pin and base is ≥1*1010Ω Hermeticity ...
2025-05-13 09:46:55
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Product name: Kovar to glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the ...
2025-05-13 09:46:55
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... Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 lead 2 copper cored alloy 8 insulator Al2O3 12 ...
2025-05-13 09:46:55
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