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laser diode package header
Selling leads
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... power and other fields. Product features: using stainless steel or 4J29 and other substrates, glass or ceramic sealing, to meet customer ...
2025-05-13 09:46:55
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Main performance parameters Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator Lead welding method: ...
2025-05-13 09:46:55
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Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip ...
2025-05-13 09:46:55
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