China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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hermetic electronic packages

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hermetic electronic packages

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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
...≥1um;Cap is plated Ni:1.3~11.43um Insulation resistance 500V DC resistance between single pin and shell is ≥1*1010Ω Hermeticity Leak rate is ≤1*10... 2025-05-13 09:46:55
...hermetically sealing circular package Plating: The bottom plate, the lead plating Ni:3-8.9um, the bottom plate and the lead plating Au>=0.03um. ... 2025-05-13 09:46:55
Product name: infrared detector package Applications: infrared detectors Product features: The infrared detector package can provide high-reliability ... 2025-05-13 09:46:55
Product model: TO-46 Product name: Suitable Coining Round Styles Pedestal Leads Are Perpendicular To The Substrate Mounting Surface Finish: Fully ... 2025-05-13 09:46:55
2025-05-13 09:46:55
2025-05-13 09:46:55
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