China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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feedthroughs hermetically sealed packaging

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feedthroughs hermetically sealed packaging

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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...uncooled infrared detectors. The main package forms are butterfly ceramic package, ceramic PGA package and ring ceramic package, which can ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
Product name: Robust Iron-Nickel-Cobalt Flatpack With Unusual Lead Forming Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating ... 2025-05-13 09:46:55
...Metal Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 lead 2 copper cored alloy 8 insulator Al2O3 12 ... 2025-05-13 09:46:55
Main performance parameters Application field: pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
...≥1um;Cap is plated Ni:1.3~11.43um Insulation resistance 500V DC resistance between single pin and shell is ≥1*1010Ω Hermeticity Leak rate is ≤1*10... 2025-05-13 09:46:55
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