China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
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dm308 hermetic package

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dm308 hermetic package

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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
..., iron-nickel alloy, copper core composite Cover plate: Kovar alloy, iron-nickel alloy, steel Insulator: DM308 or similar, 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
... metal package for HIC custom hermetic package Product Model JOPTEC Finish: Shell and pins are plated Ni 1-11.43um and plated Au≥1.0um Insulation ... 2025-05-13 09:46:55
Main performance parameters Application field: pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
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