51 - 60 of 64
brazing hermetic electronic packages
Selling leads
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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating ...
2025-05-13 09:46:55
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...Package With 4J29 Alloy Product formation Material Quantity 1. bottom 4J29 1 2. lead 4J29 5 3. T shaped lead 4J29 1 4. glass insulator DM-305 5 5. ...
2025-05-13 09:46:55
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...Package Gold Plating Butterfly Package Finish Fully plating Au or selective plating Au Plating coating Shell and leads are plated Ni:1.3~11.43um ...
2025-05-13 09:46:55
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...Package Gold Plating Butterfly Package Finish Fully plating Au or selective plating Au Plating coating Shell and leads are plated Ni:1.3~11.43um ...
2025-05-13 09:46:55
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...Package Gold Plating Butterfly Package Finish Fully plating Au or selective plating Au Plating coating Shell and leads are plated Ni:1.3~11.43um ...
2025-05-13 09:46:55
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Product name: High Volume TO Header TO-39 Header Plating: The bottom plate, the lead plating Ni:3-8.9um, the bottom plate and the lead plating Au>=0...
2025-05-13 09:46:55
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Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ...
2025-05-13 09:46:55
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Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip ...
2025-05-13 09:46:55
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Product name: Kovar to glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the ...
2025-05-13 09:46:55
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... Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 lead 2 copper cored alloy 8 insulator Al2O3 12 ...
2025-05-13 09:46:55
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