China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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Product name: Customized Iron-Nickel-Cobalt Flatpack Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: Package,pin... 2025-05-13 09:46:55
Product Name Plug-in Platform Metal Package Plating Coating Fully Plating Au or Selective Plating Au Finish Header and cap is plated Ni:3~11.43um and ... 2025-05-13 09:46:55
Product Name Well Suited Metal Package Flat Bottom Package With 1.5mm Depth In Top Seal Plating Coating Fully Plating Au or Selective Plating Au ... 2025-05-13 09:46:55
Product name: Highly Customized High Frequency Microwave Package Finish: Fully plating Au(or choose selective plating). Plating coating: The package, ... 2025-05-13 09:46:55
Product name: Electronic Components Enclosures Cavity Rf Microwave Package Finish: Fully plating Au(or choose selective plating). Plating coating: The ... 2025-05-13 09:46:55
Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ... 2025-05-13 09:46:55
Technical characteristics: Micro channel heat sink Flatness of chip mounting area ≤ 2 um Roughness of chip mounting area ≤ 0.3 um Plating thickness: ... 2025-05-13 09:46:55
Product name: High quality Customized Ceramic To Metal Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 ... 2025-05-13 09:46:55
Product name: Metal Base Cavity Kovar/Aluminium Package for IC Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating Coating ... 2025-05-13 09:46:55
Product model TO-8X Product name TO8-X Package With 4J29 Alloy Product formation Material Quantity 1. bottom 4J29 1 2. lead 4J29 5 3. T shaped lead ... 2025-05-13 09:46:55
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