Module Hermetically Sealed Electronic Packages

Main performance parameters

• Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator
• Lead welding method: tin welding, gold wire bonding
• Nickel layer thickness: >3μm
• Gold layer thickness:> 0.45μm
• Hermeticity: leak rate ≤1x10^-3Pa.cm³/s (He)
• Insulation resistance: ≥1000MΩ (DC500V)
• material:
• Base: Kovar alloy, iron-nickel alloy, copper
• Ring frame: Kovar alloy, steel
• Lead: Kovar alloy, iron-nickel alloy, copper core composite
• Cover plate: Kovar alloy, iron-nickel alloy, steel
• Insulator: DM308 or similar, iron sealed glass beads, ceramic
• Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding