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high performance copper clad substrate
Selling leads|
...high-frequency applications requiring exceptional reliability and performance. Constructed from a ceramic thermoset polymer composite, the TMM10 is ...
2026-04-13 05:31:19
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...material that integrates the electrical performance of PTFE/woven glass laminates with the manufacturability of epoxy/glass substrates. It is ...
2026-04-13 05:31:19
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... of high-frequency and microwave applications with superior electrical and mechanical characteristics. PCB Specification Item Details Base Material ...
2026-04-13 05:31:19
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..., making it the ideal choice for cellular base stations, automotive radar, and RF identification systems. The stack-up of this PCB consists of: - ...
2026-04-13 05:31:19
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... outer layers feature a 1oz (1.4 mils) copper weight, complemented by a finished board thickness of 0.6mm and a via plating thickness of 20 μm, all ...
2026-04-13 05:31:19
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... it suitable for a wide range of applications in various industries. This 4-layer rigid-flex PCB features a stackup design that ensures optimal ...
2026-04-13 05:31:19
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...high-frequency performance, dimensional stability, and circuit miniaturization. PCB Specification Parameter Specification Layer Count 2-layer rigid ...
2026-04-13 05:31:19
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...adopts 1oz (1.4 mils) copper weight for outer layers, with a finished board thickness of 0.2mm and via plating thickness of 20 μm, ensuring stable ...
2026-04-13 05:31:19
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