0.2mm Ultra-Thin 2-Layer F4BME245 RF PCB Immersion Gold Bare Circuit

This PCB delivers ultra-thin microwave performance for RF and radar hardware, built as a custom double-sided rigid circuit based on Wangling F4BME245 PTFE composite laminate. Measuring 85.6 mm × 47 mm and held to a tight ±0.15mm dimensional tolerance, this finished board is only 0.2mm thick. It adopts immersion gold surface finish; there is no solder mask or silkscreen applied on either side, leaving the copper features fully exposed for optimized high-frequency signal transmission. Fine-line routing capability reaches 4/7 mil minimum trace and space, paired with a 0.5mm minimum hole size to accommodate mixed through-hole and top-side SMT component mounting. Every unit undergoes full electrical testing before dispatch, complies with IPC-Class-2 quality standards, and worldwide delivery is available for prototype and custom batch orders.

PCB Specifications

All fabrication parameters are precisely controlled to preserve stable microwave signal integrity. The table below outlines the full manufacturing specifications for this custom F4BME245 RF PCB.

PCB Stack-up Structure

This two-layer stack-up uses a slim F4BME245 dielectric core, with copper foil laminated to both sides of the substrate to maintain consistent electrical response across microwave bands. See the table below for complete layer breakdown.

PCB Statistics

This layout combines through-hole pads and top-mounted SMT pads. All design files can be supplied in standard Gerber RS-274-X format, compatible with mainstream PCB fabrication and inspection systems. The table below lists layout statistics for this design.

Introduction of F4BME245

Wangling's F4BME245 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B245, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME245: Clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

Features and Benefits:

• The electrical and mechanical properties of F4BME245 can be precisely tuned by modifying the proportion of PTFE and woven fiberglass cloth in the composite structure. This supports custom dielectric constants while retaining low-loss performance and improved dimensional stability.
• Raising the fiberglass loading delivers a higher dielectric constant, bringing better dimensional stability, reduced thermal expansion coefficient and lower temperature drift.
• Material formulation comes with a balanced tradeoff: a higher fiberglass proportion may lead to a slight rise in dielectric loss.
• Such flexible material design empowers RF engineers to pick the most suitable grade, striking an ideal balance between electrical performance, mechanical strength and manufacturability.

Some Typical Applications:

• Microwave, RF, and Radar
• Phase Shifters, Passive Components
• Power Dividers, Couplers, Combiners
• Feed Networks, Phased Array Antennas
• Satellite Communication, Base Station Antennas

Summary

Crafted for high-precision microwave and RF circuits, this ultra-thin 2-layer F4BME245 PCB features immersion gold plating and fully adheres to IPC-Class-2 requirements. Each finished board passes full electrical inspection before shipment. Its bare-copper construction without solder mask or silkscreen minimizes signal interference, while the low-loss F4BME245 substrate preserves stable RF performance. It works well for passive microwave components, phased array antennas and satellite communication hardware, with global shipping supported.