High Frequency F4BTMS233 PCB 2-Layer ENIG Rigid Board Black Solder Mask

This PCB is engineered to meet stringent demands within aerospace, military radar and microwave RF sectors, built as a bespoke two-layer rigid circuit based on premium F4BTMS233 high-frequency dielectric material. With physical dimensions of 49mm × 78.6mm held to a tight ±0.15mm tolerance and a finished overall thickness of 1.1mm, this board adopts ENIG surface treatment to deliver dependable solderability and robust corrosion resistance. Black solder mask and white silkscreen markings are only applied to the top side, leaving the bottom surface bare and uncoated. This construction utilises through-hole construction exclusively, with no blind vias included. It supports 5/8 mil minimum trace and space routing alongside a 0.4mm minimum hole diameter, catering to mixed through-hole and top-side SMT component layouts. All units complete full electrical screening prior to delivery, adhere to IPC-Class-2 quality specifications, and global shipping is available for custom prototype and volume orders in specialised high-frequency electronics.

PCB Specifications

Fabrication parameters are precisely controlled to maintain stable electrical performance under microwave operating conditions. The table below summarises all core manufacturing specifications of this custom F4BTMS233 PCB.

PCB Stack-up Structure

This two-layer stack-up features a balanced architecture centred on a thin F4BTMS233 dielectric core. Copper foils are laminated onto both sides of the core to sustain uniform electrical performance across the entire board area. The table below details the full layer composition.

PCB Statistics

This PCB layout combines through-hole and SMT pads. All design files are supplied in standard Gerber RS-274-X format, compatible with most mainstream PCB fabrication systems. The table below lists component, pad and net statistics for this design.

F4BTMS Introduction

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.

Features (F4BTMS233)

• Dielectric constant (Dk) of 2.33 at 10GHz
• Dissipation factor of .0010 at 10GHz, 0.0011 at 20GHz
• CTE x-axis of 35 ppm/°C, CTE y-axis of 40 ppm/°C, CTE z-axis of 220 ppm/°C, -55°C to 288°C
• Low thermal coefficient of Dk at -122 ppm/°C, -55°C to 150°C
• UL-94 V0
• Low Moisture absorption of 0.02%

Typical Applications

The stable electrical and mechanical characteristics of this F4BTMS233 two-layer rigid PCB make it suitable for a range of high-frequency markets and challenging operating environments:

• Aerospace equipment, space and cabin equipment
• Microwave, RF
• Radar, military radar
• Feed networks
• Phase-sensitive antennas, phased array antennas
• Satellite communications, and more.

Summary

Built to satisfy rigorous aerospace and microwave RF requirements, this bespoke F4BTMS233 2-layer rigid PCB utilises ENIG surface finish and fully meets IPC-Class-2 standards. Every completed board undergoes comprehensive electrical inspection before leaving production. Its carefully engineered stack-up paired with low-loss F4BTMS233 substrate maintains consistent signal integrity at microwave frequencies. It acts as a trusted circuit solution for phased array antennas, radar platforms and aerospace hardware projects, with worldwide delivery options available.