China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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shockproof thermal conductive sheet

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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shockproof thermal conductive sheet

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...thermal sheet Thermal Insulation Pad for power modules Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - ... 2024-12-09 17:19:32
...thermal sheet Thermal Insulation Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual ... 2024-12-09 17:19:32
...thermal sheet Thermal Insulation Pad for power modules Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - ... 2026-04-06 00:29:56
...thermal sheet Thermal Insulation Pad Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual ... 2026-04-06 00:29:56
30 ShoreOO Hardness 1.0W/m.K Ultra Soft Thermal Silicone Pad For 5G Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
30 ShoreOO Hardness 1.0W/m.K Ultra Soft Thermal Silicone Pad For 5G Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2026-04-06 00:29:56
0.5mm Thickness Pink Silicone Thermal Pad Material For Led Lighting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:19:32
0.5mm Thickness Pink Silicone Thermal Pad Material For Led Lighting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
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