Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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sensor thermally conductive encapsulant

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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sensor thermally conductive encapsulant

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100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads

Ultra Soft Thermal Pad 100x100x1mm Silicone SSD CPU FPU LED Heatsink PC Cooling Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads

Ultra Soft Thermal Pad 100x100x1mm Silicone SSD CPU FPU LED Heatsink PC Cooling Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25

Nontoxic Antiwear Thermally Conductive Interface Pads Electronics Heatproof

0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ... 2024-12-09 17:19:32

Practical PCB Heat Sink Pad, Nontoxic Thermal Conductive Adhesive Pad

Wholesale Customized Silicone Insulation Material Yellow Thermal Insulation Pad For PCB Attribute Value Test Method Product TC1500B - Composition ... 2024-12-09 17:19:32

Nontoxic Antiwear Thermally Conductive Interface Pads Electronics Heatproof

0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ... 2025-01-02 00:10:25

Practical PCB Heat Sink Pad, Nontoxic Thermal Conductive Adhesive Pad

Wholesale Customized Silicone Insulation Material Yellow Thermal Insulation Pad For PCB Attribute Value Test Method Product TC1500B - Composition ... 2025-01-02 00:10:25

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Two Part Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Two Part Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

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