Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Two Part Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

Features & Benefits

1 High thermal conductivity, low thermal resistance, excellent wettability
2 Low pressure to electronic components
3 Manageable raw material stock ,lower composite cost
4 For vehicle electronic products
5 Can fill any uneven gaps
6 Automatic point dispensing available, any thickness or size available
7 High reliability, thermal conductive gel is equal to thermal conductive silicon pad after curing, no volatility.

Typical Applications

1 Communication equipment
2 Power equipment
3 Medical instrument
4 New energy vehicle
5 Filling any gap between friable component and shell

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.