Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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practical silicone sealant thermal conductivity

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Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Practical Silicone Thermal Potting Compound , RoHS Certification High Thermal Conductivity Compound

High Breakdown Voltage Thermal Conductivity Silicone Encapsulating For Electric Machinery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Practical Silicone Thermal Potting Compound , RoHS Certification High Thermal Conductivity Compound

High Breakdown Voltage Thermal Conductivity Silicone Encapsulating For Electric Machinery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Silicone Thermal Conductivity Gap Filler Multiscene Flame Retardant

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13

2.9G/CC Silicone Thermal Conductive Gap Filler Multipurpose Durable

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13

2.9G/CC Silicone Thermal Conductive Gap Filler Multipurpose Durable

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

2.9g/CC CPU GPU Silicone Free Thermal Pad Heatproof Weather Resistant

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 17:19:13

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