China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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2.9G/CC Silicone Thermal Conductive Gap Filler Multipurpose Durable

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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2.9G/CC Silicone Thermal Conductive Gap Filler Multipurpose Durable

Brand Name AOK
Model Number TM300
Certification RoHS, Reach, UL
Place of Origin China
Minimum Order Quantity 400 ml (200 ml each part)
Payment Terms T/T
Delivery Time 13-15 working days
Packaging Details 50 ml (25 ml each part)/ 400 ml (200 ml each part)/ 20 kg(10 kg each part)
Composition Ceramic filler + Silicone
Color Green
Density 2.9 g/cc
Breakdown Voltage ≥5.0 kv/mm
Usage Temperature -40 ℃ ~ 150 ℃
Thermal Resistance 0.3 (℃-in2/W)0.1mm@50psi
Dielectric Constant 7.3(@10mhz)
Flammability V-0
Thermal conductivity 3.0 W/m.K
Detailed Product Description

Silicone Thermal Conductive Gap Filler With Room Temperature Curing For LED

 

AttributeValueTest Method
CompositionCeramic filler + Silicone-
ColorGreenVisual
Density(g/cc)2.9ASTM D792
Extrudability(g/s)5.0ISO9048
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)≥5.0ASTM D149
Dielectric Constant(@10mhz)7.3ASTM D150
Volume Resistivity(Ω.cm)1.0*1014ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)3.0ASTM D5470

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300 ml Cartridge/1Kg Jar/20Kg Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Product Tags: 2.9G/CC Thermal Conductive Gap Filler   Silicone Thermal Conductive Gap Filler   Multipurpose Thermal Conductive Filler  
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