Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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practical silicone sealant thermal conductivity

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1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2025-01-02 00:10:25

Pink 2.3 G/CC Thermal Conductive Pad Self Adhesive Elastic For 5G

Low Oil Permeability Low Volatility Pink Silicone Thermal Conductive Pad For 5G Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

3W/m.K Thermal Conductive Gap Filler Single Part For Displays

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13

Electrically Thermally Conductive Gap Filler Multiscene

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13

Gray Heat Thermally Conductive Encapsulant Shockproof Multiscene

Thermally Conductive Encapsulant Gray Elastomer With Moderate Thermal Conductivity Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13

3W/m.K Thermal Conductive Gap Filler Single Part For Displays

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Electrically Thermally Conductive Gap Filler Multiscene

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Gray Heat Thermally Conductive Encapsulant Shockproof Multiscene

Thermally Conductive Encapsulant Gray Elastomer With Moderate Thermal Conductivity Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

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