Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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odorless thermal compound paste

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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odorless thermal compound paste

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White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13

RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

UL Certification Heatproof Thermally Conductive Potting Compound For Electronics

White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13

Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Durable 1.8G/CC Thermally Conductive Silicone Potting Compound For Electronics

high voltage applications Thermal Conductive Encapsulant Potting Electric Potting Silicone Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Durable 1.8G/CC Thermally Conductive Silicone Potting Compound For Electronics

high voltage applications Thermal Conductive Encapsulant Potting Electric Potting Silicone Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

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