Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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odorless thermal compound paste

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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odorless thermal compound paste

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Durable Industrial Ultra Soft Thermal Pad With Thermal Paste 0.5mm Thickness

0.5mm Thickness Ultra Soft 1.0W/m.K Thermal conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Durable Industrial Ultra Soft Thermal Pad With Thermal Paste 0.5mm Thickness

0.5mm Thickness Ultra Soft 1.0W/m.K Thermal conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25

Anti Corrosion Potting Compound , Heat Resistant Electronic Thermal Conductive Gap Fillers

1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13

AOK White High Temperature Potting Compound , Electrically Insulating Thermal Silicone Glue

White Thermally Conductive Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13

Anti Corrosion Potting Compound , Heat Resistant Electronic Thermal Conductive Gap Fillers

1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

AOK White High Temperature Potting Compound , Electrically Insulating Thermal Silicone Glue

White Thermally Conductive Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25

RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

UL Certification Heatproof Thermally Conductive Potting Compound For Electronics

White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13

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