Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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network silicone cpu pad

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Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:32

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2025-01-02 00:10:25

3W/m.K Multipurpose Thermal Conductive Pad Heatsink For Networking

Low thermal resistance 3W/m.K thermal Conductive pad for Networking and Telecommunications Attribute Value Test Method Composition Ceramic Filler + ... 2024-12-09 17:19:13

3W/m.K Multipurpose Thermal Conductive Pad Heatsink For Networking

Low thermal resistance 3W/m.K thermal Conductive pad for Networking and Telecommunications Attribute Value Test Method Composition Ceramic Filler + ... 2025-01-02 00:10:25

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2025-01-02 00:10:25

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