Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K
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Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity
Product feature: ■ because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface; ■ with the addition of thermal silica gel, can make the contact surface between the heat source and the radiator better full contact, really do face to face contact. The reaction at temperature can achieve as small a temperature difference as possible;
Typical applications:
Purchase information:
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
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Product Tags: Multiscene Laptop CPU Thermal Pad Anti Interfere Laptop CPU Thermal Pad 1W/m.K Thermal Cooling Pad Laptop |
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