China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Brand Name AOK
Model Number UTP100
Certification RoHS, Reach, UL
Place of Origin China
Minimum Order Quantity 1000pcs
Payment Terms T/T
Delivery Time 13-15working days
Packaging Details 400mmx200mm
Tensile Strength(KN/m) 2.5
Elongation(%) 60
Usage Temperature(℃) -40~150
Product name Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity
Density 2.5(g/cc)
Hardness 30±5(Shore OO)
Detailed Product Description

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity

AttributeValueTest Method
CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
ColorWhite and Brick RedVisual
Thickness(mm)0.5~12.0ASTM D374
Density(g/cc)2.5ASTM D792
Hardness(shore oo)30±5ASTM D2240
Tensile Strength(KN/m)2.5ASTM D624
Elongation(%)60ASTM D412
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)≥7.0ASTM D149
Dielectric Constant(@10mhz)5.7ASTM D150
Volume Resistivity(Ω.cm)1.0*1013ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

 

Product feature:
■ Naturally tacky on one side
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;

■ with the addition of thermal silica gel, can make the contact surface between the heat source and the radiator better full contact, really do face to face contact. The reaction at temperature can achieve as small a temperature difference as possible;

 

Typical applications:
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

 

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Product Tags: Multiscene Laptop CPU Thermal Pad   Anti Interfere Laptop CPU Thermal Pad   1W/m.K Thermal Cooling Pad Laptop  
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