Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

Home > Products >

multipurpose thermal pad cpu cooling

Browse Categories

Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

71 - 80 of 104

multipurpose thermal pad cpu cooling

Selling leads

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25

Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13

Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00

Durable Silicone CPU GPU Heat Pads Multiscene Anti Insulation

High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Durable Silicone CPU GPU Heat Pads Multiscene Anti Insulation

High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

Ultrasoft Multiscene Thermal Heat Pads Electronics Anti Interfere

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 17:19:13

Ultrasoft Multiscene Thermal Heat Pads Electronics Anti Interfere

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2025-01-02 00:10:25

RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25

Page 8 of 11 : |< << 1 2 3 4 5 6 7 8 9 10 11 >> >|