Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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multipurpose thermal pad cpu cooling

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Silicone Practical Heatsink Cooling Pad , Reach Thermal Interface Material Pad

0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32

Silicone Practical Heatsink Cooling Pad , Reach Thermal Interface Material Pad

0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2025-01-02 00:10:25

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2025-01-02 00:10:25

Purple Heatproof PCB Heat Sink Pad , Anti Insulation Thermal Interface Pad

Purple Heatsink Cooling Elevated Tempera Silicone Thermal Conductive Pad With 4.0W/m.K For LEDs Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13

Purple Heatproof PCB Heat Sink Pad , Anti Insulation Thermal Interface Pad

Purple Heatsink Cooling Elevated Tempera Silicone Thermal Conductive Pad With 4.0W/m.K For LEDs Attribute Value Test Method Composition Ceramic Filler ... 2025-01-02 00:10:25

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

Odorless Thermal Tape For GPU , Anti Corrosion Silicone Heat Sink Pad

1.4 W/m.k Yellow Silicone Thermal Insulation Pad For Server Cooling With Long Shelf Life Attribute Value Test Method Product TC1500B - Composition ... 2024-12-09 17:19:32

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

Odorless Thermal Tape For GPU , Anti Corrosion Silicone Heat Sink Pad

1.4 W/m.k Yellow Silicone Thermal Insulation Pad For Server Cooling With Long Shelf Life Attribute Value Test Method Product TC1500B - Composition ... 2025-01-02 00:10:25

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