China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multipurpose thermal conductive pads heatsink

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multipurpose thermal conductive pads heatsink

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Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ..... 2024-12-09 17:19:13
Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ..... 2025-01-02 00:10:25
...Thermal Conductivity Thermal Insulation Silicone Pad For PV Inverter Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2024-12-09 17:19:32
...Thermal Conductivity Thermal Insulation Silicone Pad For PV Inverter Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2025-01-02 00:10:25
Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For LEDs Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green ... 2024-12-09 17:19:13
Silicone Thermal Conductive Gap Filler With Room Temperature Curing For LED Attribute Value Test Method Composition Ceramic filler + Silicone - Color ... 2024-12-09 17:19:13
Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For LEDs Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green ... 2024-12-09 22:03:00
Silicone Thermal Conductive Gap Filler With Room Temperature Curing For LED Attribute Value Test Method Composition Ceramic filler + Silicone - Color ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
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