China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Anticorrosive Thermal Conductive Gap Filler anti vibration Multipurpose

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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Anticorrosive Thermal Conductive Gap Filler anti vibration Multipurpose

Brand Name AOK
Model Number TM
Certification RoHS, Reach, UL
Place of Origin China
Minimum Order Quantity 400ml(200ml each part)
Payment Terms T/T
Delivery Time 13-15working days
Packaging Details 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Product Name Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For LEDs
Composition Ceramic filler + Silicone
Density 2.9(g/cc)
Breakdown Voltage ≥5.0(kv/mm)
Usage Temperature -40~150(℃)
Thermal conductivity 3.0(W/m.K)
Detailed Product Description

Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For LEDs

 

AttributeValueTest Method
CompositionCeramic filler + Silicone-
ColorGreenVisual
Density(g/cc)2.9ASTM D792
Extrudability(g/s)5.0ISO9048
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)≥5.0ASTM D149
Dielectric Constant(@10mhz)7.3ASTM D150
Volume Resistivity(Ω.cm)1.0*1014ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)3.0ASTM D5470

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
The thermal conductivity gap filler has ultra-low thermal resistance, which can optimize the heat dissipation performance of the product.
The research and design is convenient. The thermal conductivity gap filler is mud like and permanent self-adhesive. The product design does not need to specially consider the limitations of product size and tolerance, and can be flexibly designed according to the effect.
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/ 1kg Jar/20kg Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Product Tags: Anticorrosive Thermal Conductive Gap Filler   Anti Vibration Thermal Conductive Gap Filler   Multipurpose Thermally Conductive Gap Filler  
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