China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multipurpose silicone thermal paste

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multipurpose silicone thermal paste

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1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
high voltage applications Thermal Conductive Encapsulant Potting Electric Potting Silicone Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
Die Cutting Blue 0.5 mm Thickness Thermal Silicone Pad Material With 8.0 W/m.K Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
0.25mm Thickness High Breakdown Voltage Thermal Insulation Silicone Pad For Inverter Attribute Value Test Method Product TC1500B - Composition ... 2024-12-09 17:19:32
Low Volatility High Thermal Conductivity Silicone Pad For Industrial Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2025-01-02 00:10:25
1.2W/m.k Thermal Conductive Pad Made Of Ceramic Filler And Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2025-01-02 00:10:25
1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2025-01-02 00:10:25
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
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