Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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multipurpose silicone thermal paste

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Durable 1.8G/CC Thermally Conductive Silicone Potting Compound For Electronics

high voltage applications Thermal Conductive Encapsulant Potting Electric Potting Silicone Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Pink Silicone Ultra Soft Thermal Pad In Laptop Weather Resistant

Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25

Silicone Practical Heatsink Cooling Pad , Reach Thermal Interface Material Pad

0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2025-01-02 00:10:25

Thickness 0.5 mm Thermal Pad Material Silicone 8 W/m.K Blue Color

Die Cutting Blue 0.5 mm Thickness Thermal Silicone Pad Material With 8.0 W/m.K Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

AOK Tasteless Heat Sink Silicone Pad, Heatproof Electrically Conductive Thermal Pad

0.25mm Thickness High Breakdown Voltage Thermal Insulation Silicone Pad For Inverter Attribute Value Test Method Product TC1500B - Composition ... 2025-01-02 00:10:25

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

...Thermally Conductive Encapsulant Potting Compound Silicone With OBC Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13

Flame Retardant Thermally Conductive Encapsulant Dustproof For Power Battery

Low Thermal Resistance 0.8W/m.K Thermally Conductive Silicone Encapsulant For Power Battery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

UL Certification Heatproof Thermally Conductive Potting Compound For Electronics

...Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13

2.5g/cc CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling

Ultra Soft thermal pad 1.5 mm thickness silicone rubber adhesive cooling laptop thermal pad Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

Weather Resistant Ultra Soft Thermal Pad 0.5mm Thickness For EV

Ultra Soft Series 1.0W/m.K 0.5mm Thermal Thermal Silicone Pad For EV Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32

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