China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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memory modules thermal conductive gap filler

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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memory modules thermal conductive gap filler

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...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00
...Thermal Conductivity Silicone Gap Filler Thermal Conductive Gap Filler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13
...Thermal Conductivity Silicone Gap Filler Thermal Conductive Gap Filler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00
Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 ... 2024-12-09 17:19:13
Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 ... 2024-12-09 22:03:00
...Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
...Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
...Thermal Conductivity Silicone Liquid Gap Filler With UL94V0 Flammability Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13
...Thermal Conductivity Silicone Liquid Gap Filler With UL94V0 Flammability Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00
3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking Attribute Value Test Method Composition Ceramic filler ... 2024-12-09 17:19:13
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