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memory modules thermal conductive gap filler
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...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity...
2025-01-02 00:10:25
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Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ...
2024-12-09 17:19:13
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1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ...
2024-12-09 17:19:13
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Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ...
2025-01-02 00:10:25
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1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ...
2025-01-02 00:10:25
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0.5mm Thickness Pink Silicone Thermal Pad Material For Power Modules Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ...
2024-12-09 17:19:32
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0.5mm Thickness Pink Silicone Thermal Pad Material For Power Modules Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ...
2025-01-02 00:10:25
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